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High Performance > 300°F | Polyetheretherketone (PEEK)

TECAPEEK CMF ceramic filled PEEK

TECAPEEK CMF has been developed with demanding semiconductor back end testing applications in mind. Because of the often intricate designs necessary for parts such as test sockets, TECAPEEK CMF has been designed with ceramic fillers to be very dimensionally stable and machinable. It resists the formation of burrs during machining, and does not absorb moisture, allowing for accurate and precise dimensions of even the smallest geometries without the necessity of secondary de-burring operations. TECAPEEK CMF is also stable over a range of temperatures while maintaining good mechanical strength and stiffness.

  • Excellent machinability with low burr formation even in the smallest dimensions
  • Minimal CLTE resulting in good dimensional stability over a wide temperature range
  • Very low moisture absorption
  • Good mechanical strength and stiffness even at high temperatures minimizing downtime
  • Tough enough to prevent material cracks even with minimal wall thicknesses

TECAPEEK CMF offers a property profile well suited to semiconductor back end test applications such as test sockets. The material exhibits surface hardness and inherent toughness along with dimensional stability and machinability.

  Properties Condition Units Value
Physical Chemical Designation PEEK
Filler Ceramic
Density g/cm_ 1.63
Mechanical Tensile Modulus @ 73 °F PSI 1,227,111
Tensile Strength @ Yld @ 73 °F PSI 14,122
Tensile Strength @ Brk @ 73 °F PSI 15,200
Shear Strength @ 73 °F PSI
Elongation @ Yld @ 73 °F % 3
Elongation @ Brk @ 73 °F % 4.85
Flexural Modulus @ 73 °F PSI 783,585
Flexural Strength @ 73 °F PSI 23,642
Compressive Modulus @ 73 °F PSI 335,369
Compressive Strength @ 73 °F, 10% strain PSI 20,712
Izod (charpy) Impact Strength @ 73 °F ft-lbs/in 0.66
Rockwell Hardness @ 73 °F M (R) Scale 102
Coefficient of Friction Static
Coefficient of Friction Dynamic, 40 PSI, 50 FPM
Wear (K) Factor in_-min/ft-lbs-hr
Limiting PV psi-fpm
Thermal Vicat Softening Point °F
Melting Temperature °F 643
Heat Deflection Temperature @ 66 °F 551
Heat Deflection Temperature @ 264 °F 572
Service Temperature Intermittent °F 500
Service Temperature Long Term °F 500
Thermal Expantion (CLTE) in/in/°F 3.10*10-5
Specific Heat BTU/lb-°F
Thermal Conductivity BTU-in/hr-ft_-°F 2.6
Electrical Surface Resistivity ohms/square 5.2*1015
Volume Resistivity ohm-cm 3.5*1015
Dielectric Strength V/mil 168
Dielectric Contant @ 60 HZ, 73 °F, 50% RH 4.71
Dissipation Factor @ 60 Hz, 73 °F 0.0032
Other Moisture Absorption @ 24 hrs, 73 °F % 0.06
Moisture absorption @ Saturation, 73 °F %
Flammability UL 94 V-0
Food Grade N
Relative Cost $$ $$ $$ $