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High Performance > 300°F | Polyimide (PI)

TECASINT 2011 unfilled PI

TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it?s longterm thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction.

  • Superior high temperature characteristics
    TECASINT™ 2011 series can operate up to 536° F continuously.
  • Excellent long-term thermal stability
  • Outstanding bearing and wear properties
    At elevated temperatures, TECASINT™ 2011 formulations offer superior wear rates.
  • Excellent creep resistance
  • High strength and stiffness properties
  • High purity characteristics
    Only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011.
  • Good chemical resistance
    TECASINT™ 2011 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids.

TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.

  Properties Condition Units Value
Physical Chemical Designation PI
Filler
Density g/cm_ 1.38
Mechanical Tensile Modulus @ 73 °F PSI 681,500
Tensile Strength @ Yld @ 73 °F PSI 17,110
Tensile Strength @ Brk @ 73 °F PSI
Shear Strength @ 73 °F PSI
Elongation @ Yld @ 73 °F %
Elongation @ Brk @ 73 °F % 4.4
Flexural Modulus @ 73 °F PSI 522,000
Flexural Strength @ 73 °F PSI 25,700
Compressive Modulus @ 73 °F PSI
Compressive Strength @ 73 °F, 10% strain PSI
Izod (charpy) Impact Strength @ 73 °F ft-lbs/in 41.8
Rockwell Hardness @ 73 °F M (R) Scale
Coefficient of Friction Static
Coefficient of Friction Dynamic, 40 PSI, 50 FPM
Wear (K) Factor in_-min/ft-lbs-hr
Limiting PV psi-fpm
Thermal Vicat Softening Point °F
Melting Temperature °F
Heat Deflection Temperature @ 66 °F
Heat Deflection Temperature @ 264 °F >600
Service Temperature Intermittent °F 626
Service Temperature Long Term °F 536
Thermal Expantion (CLTE) in/in/°F 3.0*10-5
Specific Heat BTU/lb-°F 0.221
Thermal Conductivity BTU-in/hr-ft_-°F 1.53
Electrical Surface Resistivity ohms/square 5.0*1016
Volume Resistivity ohm-cm 8.0*1015
Dielectric Strength V/mil 544
Dielectric Contant @ 60 HZ, 73 °F, 50% RH
Dissipation Factor @ 60 Hz, 73 °F 0.003
Other Moisture Absorption @ 24 hrs, 73 °F % 0.24
Moisture absorption @ Saturation, 73 °F %
Flammability UL 94 V-0
Food Grade N
Relative Cost $$ $$ $$ $$