TECASINT 2011 unfilled PI
TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it?s longterm thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction.
- Superior high temperature characteristics
TECASINT™ 2011 series can operate up to 536° F continuously.
- Excellent long-term thermal stability
- Outstanding bearing and wear properties
At elevated temperatures, TECASINT™ 2011 formulations offer superior wear rates.
- Excellent creep resistance
- High strength and stiffness properties
- High purity characteristics
Only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011.
- Good chemical resistance
TECASINT™ 2011 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids.
TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.
|Mechanical||Tensile Modulus||@ 73 °F||PSI||681,500|
|Tensile Strength @ Yld||@ 73 °F||PSI||17,110|
|Tensile Strength @ Brk||@ 73 °F||PSI|
|Shear Strength||@ 73 °F||PSI|
|Elongation @ Yld||@ 73 °F||%|
|Elongation @ Brk||@ 73 °F||%||4.4|
|Flexural Modulus||@ 73 °F||PSI||522,000|
|Flexural Strength||@ 73 °F||PSI||25,700|
|Compressive Modulus||@ 73 °F||PSI|
|Compressive Strength||@ 73 °F, 10% strain||PSI|
|Izod (charpy) Impact Strength||@ 73 °F||ft-lbs/in||41.8|
|Rockwell Hardness||@ 73 °F||M (R) Scale|
|Coefficient of Friction||Static|
|Coefficient of Friction||Dynamic, 40 PSI, 50 FPM|
|Wear (K) Factor||in_-min/ft-lbs-hr|
|Thermal||Vicat Softening Point||°F|
|Heat Deflection Temperature||@ 66||°F|
|Heat Deflection Temperature||@ 264||°F||>600|
|Service Temperature||Long Term||°F||536|
|Thermal Expantion (CLTE)||in/in/°F||3.0*10-5|
|Dielectric Contant||@ 60 HZ, 73 °F, 50% RH|
|Dissipation Factor||@ 60 Hz, 73 °F||0.003|
|Other||Moisture Absorption||@ 24 hrs, 73 °F||%||0.24|
|Moisture absorption||@ Saturation, 73 °F||%|
|Relative Cost||$$ $$ $$ $$|