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High Performance > 300°F | Polyamidimide (PAI)

TECATOR TI5013 unfilled PAI

TECATOR is a high performance melt processable polyamide-imide, that maintains its excellent mechanical and wear properties in temperature environments exceeding 500°F. TECATOR TI5013, is a high strength structural grade featuring good electrical properties and strength, making it ideal for demanding applications at a broad range of temperatures.

  • Excellent weather and gamma radiation resistance
  • Outstanding bearing and wear properties
  • High strength and stiffness
  • Excellent electrical values
    TECATOR™TI5013 has a dielectric strength of 600 V/mil.
  • Good chemical resistance
    TECATOR™is not attacked by common solvents or fuels and is acceptable for use in contact with many acids.
  • Maintains a high proportion of mechanical properties over a broad temperature spectrum - cryogenic to 500°F.

TECATOR™(PAI) typical applications: Pump parts, valve seats, piston rings, seal rings, engine transmission parts and bearing cages. For the semiconductor industry it is used for ?burn in? test sockets, nests, chassis and other applications such as welding nozzle tips.

  Properties Condition Units Value
Physical Chemical Designation PAI
Filler
Density g/cm_ 1.41
Mechanical Tensile Modulus @ 73 °F PSI
Tensile Strength @ Yld @ 73 °F PSI
Tensile Strength @ Brk @ 73 °F PSI 21,000
Shear Strength @ 73 °F PSI
Elongation @ Yld @ 73 °F %
Elongation @ Brk @ 73 °F % 15
Flexural Modulus @ 73 °F PSI 711,000
Flexural Strength @ 73 °F PSI 33,000
Compressive Modulus @ 73 °F PSI
Compressive Strength @ 73 °F, 10% strain PSI 30,000
Izod (charpy) Impact Strength @ 73 °F ft-lbs/in 2.3
Rockwell Hardness @ 73 °F M (R) Scale 119
Coefficient of Friction Static
Coefficient of Friction Dynamic, 40 PSI, 50 FPM
Wear (K) Factor in_-min/ft-lbs-hr
Limiting PV psi-fpm
Thermal Vicat Softening Point °F
Melting Temperature °F
Heat Deflection Temperature @ 66 °F
Heat Deflection Temperature @ 264 °F 532
Service Temperature Intermittent °F
Service Temperature Long Term °F 500
Thermal Expantion (CLTE) in/in/°F 1.66*10-5
Specific Heat BTU/lb-°F
Thermal Conductivity BTU-in/hr-ft_-°F
Electrical Surface Resistivity ohms/square 5*1015
Volume Resistivity ohm-cm
Dielectric Strength V/mil 600
Dielectric Contant @ 60 HZ, 73 °F, 50% RH
Dissipation Factor @ 60 Hz, 73 °F
Other Moisture Absorption @ 24 hrs, 73 °F % 0.30
Moisture absorption @ Saturation, 73 °F %
Flammability UL 94 V-0
Food Grade N
Relative Cost $$ $$ $$